Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/109622
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Type: Journal article
Title: Folded substrate-integrated waveguide band-pass post filter
Author: Zhao, C.
Fumeaux, C.
Lim, C.
Citation: IEEE Microwave and Wireless Components Letters, 2017; 27(1):22-24
Publisher: IEEE
Issue Date: 2017
ISSN: 1531-1309
1558-1764
Statement of
Responsibility: 
Cheng Zhao, Christophe Fumeaux and Cheng-Chew Lim,
Abstract: This letter presents a novel concept of band-pass filter realized with metal posts in folded substrate-integrated waveguide (FSIW) technology, together with an efficient specific design procedure. As a first step, it is shown that a particular dimension of the middle vane in the FSIW yields an equivalence to a dielectric-loaded unfolded rectangular waveguide. This equivalence is investigated by comparing the modal dispersion characteristics in both folded and unfolded structures. A direct comparison of the posts placed in the FSIW and in the equivalent unfolded waveguide then further confirms their similar characteristics. As a result, the classical mode-matching method (MMM), straightforwardly applied in the equivalent unfolded structure, can be used to efficiently design a post filter in FSIW technology. For illustration, the method is applied to realize a 5th-order Chebyshev band-pass post FSIW filter with a center frequency of 7GHz and a fractional bandwidth of 5.71%. The viability and efficiency of the design approach is successfully validated by finite-element simulations and measurements.
Keywords: Band-pass filter; Chebyshev filter; folded substrate-integrated waveguide (FSIW)
Rights: © 2017 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information.
DOI: 10.1109/LMWC.2016.2630004
Published version: http://dx.doi.org/10.1109/lmwc.2016.2630004
Appears in Collections:Aurora harvest 8
Electrical and Electronic Engineering publications

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