Please use this identifier to cite or link to this item:
https://hdl.handle.net/2440/3436
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Type: | Journal article |
Title: | Seiberg-Witten-Floer homology and gluing formulae |
Author: | Carey, Alan L. Wang, Bai |
Citation: | Acta Mathematica Sinica, English Series, 2003; 19(2):245-296 |
Publisher: | Springer-Verlag Singapore Pte Ltd |
Issue Date: | 2003 |
ISSN: | 1439-8516 |
Statement of Responsibility: | Carey, Alan; Wang, Bai |
DOI: | 10.1007/s10114-003-0262-6 |
Appears in Collections: | Pure Mathematics publications |
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